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Intel Collaborates with HCLTech to Advance Semiconductor Manufacturing

This collaboration will offer semiconductor manufacturers, system OEMs, and cloud services providers a robust ecosystem for semiconductor sourcing.

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HCL Intel Partnership

HCLTech and Intel Foundry have announced their decision to expand their collaboration to co-develop silicon solutions to improve semiconductor innovation globally. This partnership will leverage HCLTech’s design expertise and Intel Foundry’s advanced technology and manufacturing capabilities. 

The goal is to establish a resilient and diversified supply chain to meet the rising global demand for semiconductor manufacturing. This collaboration will offer semiconductor manufacturers, system OEMs, and cloud services providers a robust ecosystem for semiconductor sourcing. Additionally, the collaboration has the potential to spur innovation by enabling the design of customised silicon solutions tailored to specific use cases.

“Intel Foundry’s advanced technologies and silicon-verified IPs in manufacturing and advanced packaging strengthens our delivery of innovative, accessible and diverse solutions to our mutual clients. This will also give them greater choice and flexibility in semiconductor sourcing,” said Vijay Guntur, President, Engineering and R&D Services, HCLTech.D

HCLTech has been collaborating with Intel for over 30 years, a relationship that has evolved through shared offerings and joint investments in various sectors, including silicon services, hardware engineering, telecom services, and more. The current focus is on jointly designing highly customised silicon solutions for companies, combining HCLTech’s design expertise with Intel’s manufacturing capabilities.

This expanded collaboration is set to further strengthen their partnership by fostering a strong and open ecosystem beneficial for clients requiring advanced silicon solutions.

Intel also announced that it has signed Microsoft as a foundry customer for a custom chip. This deal is part of Intel’s plan to overtake TSMC using its Intel 18A and upcoming 14A manufacturing technologies. The 18A, a 1.8nm technology, is set for early 2025 and will be used for future CPUs in both consumer and data centre markets. The 14A, planned for late 2026, will introduce a more advanced lithography tool for smaller and more efficient chips. 

Together with its collaboration with HCLTech to develop customised silicon solutions, Intel aims to meet the growing demand for semiconductors. 

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K L Krithika

K L Krithika is a tech journalist at AIM. Apart from writing tech news, she enjoys reading sci-fi and pondering the impossible technologies, trying not to confuse it with reality.
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